Early stages of copper microparticles electrodeposition on polypyrrole film
Type : Publication
Auteur(s) : , , ,
Année : 2019
Domaine : Sciences des matériaux
Revue : Composites Communications
Résumé en PDF :
Fulltext en PDF :
Mots clés : composites, copper, electrodeposition, polymer, thin film
Auteur(s) : , , ,
Année : 2019
Domaine : Sciences des matériaux
Revue : Composites Communications
Résumé en PDF :
Fulltext en PDF :
Mots clés : composites, copper, electrodeposition, polymer, thin film
Résumé :
In this work, we studied the electrodeposition of copper (Cu) microparticles on polypyrrole (PPy) ?lms using cyclic voltammetry and chronoamperometry techniques. The initial stages of Cu deposition were investigated by performing current transients. Models based on Scharifker and Hills calculations were established to determine the nucleation and growth type. The results suggest that the deposition of Cu proceeds via an instantaneous nucleation followed by three-dimensional (3D) di?usion-limited growth. The values of the number density of active sites N∞ and di?usion coe?cient D were also determined.