Electroless copper deposition on epoxy glass substrate for electrocatalysis of formaldehyde

Type : Publication
Auteur(s) :  C. Dehchar, I. CHIKOUCHE, R. KHERRAT, A. Sahari, A. Zouaoui, A. MERATI
Année :  2018
Domaine : Sciences des matériaux
Revue : Materials Letters
Résumé en PDF :  (résumé en pdf)
Fulltext en PDF :  (.pdf)
Mots clés :  copper, electroless plating, Formaldehyde, Oxidation, Thin films

Résumé : 

In this paper, we investigated the characteristics of a structured copper (Cu) ?lm deposited on the surface of an insulating epoxy glass (EG) substrate via a facile electroless plating process. The ?lm produced by this method was found to be of high purity and has a homogeneous microstructure consisting of an assembly of numerous aggregates that vary in size from 1 to 5 mm depending on the electroless deposition time. The electrocatalytic activity of the prepared electrode was investigated for the electrooxidation of formaldehyde using cyclic voltammetry in 0.1 M NaOH solution. Results show that formaldehyde oxidation takes place at a low potential of -0.34 V with large anodic current densities.