Microstructural and tribological characterizations of a Hard material composite: WC-WMn-Ni/Cu-Sn/assembled with cermet (WC-Co) by brazing process.

Type : Article de conférence
Auteur(s) :  N.Bouzegzi, D.Miroud, Z.BOUTAGHOU 1, I.Daoud, K.Khenfer, F.AHNIA
Année :  2016
Domaine : Sciences des matériaux
Conférence: 7th African Conference on Non Destructive Testing (ACNDT) & the 5th International Conference on NDT and Materials Industry and Alloys (IC-WNDT-MI)
Lieu de la conférence:  Oran, Algeria
Résumé en PDF :  (résumé en pdf)
Fulltext en PDF :  (.pdf)
Mots clés :  powder, infiltration, Brazing, diffusion, interfaces, wear.

Résumé : 

This study focuses in microstructural and tribological characterizations of an assemblage.This assemblage is a Hard Materiales composite obtained by infiltration process of loose powder(WC/WC- W-Cu-Mn-Ni) using bronze alloyed with Ni as binder, assembled with cermet (WC-Co) bybrazing process using filler metal of Ag basic(Ag21Zn16Cu8Mn5Ni),2Hard Materiales composites or Cemented carbides are heterogeneous materials [1]; they are a classof metal matrix composites (MMCs) [2].The main feature of the hard metals composites is the combination of a tough metal binder with ahard material phase. This arrangement of phases offers an enhanced performance of certain materialproperties such as an excellent wear resistance [3_5]. This assemblage used in our study is similar tothe Diamond tools with PDC (Polycrystalline Diamond Compact) obtained by infiltration and brazingprocess, used in the field of oil and mining.Microstructural characterizations show a strong interaction between the binder phase andcompounds of powder in the infiltration process. The interface formed by the brazed joint is due tothe wide diffusion between the two assembled materials and there is formation of an inter-diffusionzone. Tribological caractérisations show, the wear behavior of materials is a complicatedphenomenon due to many variables governing it, such as sliding parameters, materials properties,abrasive effects etc.